108SP Thermostatic Bimetal alloy strip

• Standard: ASTM, GB, DIN
• Surface Treatment: Galvanized
• Technique: -
• Application: Boiler Plate
• Edge: -
• Stock: Stock
• Model NO.: 108SP
• Than bending: 20.5
• resistivity: 1.12
• density: 7.7g/cm³
• Allows the use of temperature: -70~260
• Linear temperature: -20~200
• Temperature curvature: 39.4
• Modulus of elasticity: 1.38
• use: Temperature compensation element
• features: High resistivity
• name: ASTM TM2
• Transport Package: Wooden Case
• Specification: 1.0*11
• Trademark: TANKII
• Origin: Shanghai
• HS Code: 7226920000
• Production Capacity: 3000 Tons/Year

Product Description

Truflex P675R, Chace 7500,Telcon200

Bimetallic TB208/110 holds very high thermal sensitivity and higher resistivity,but the modulus of elasticity and allowable stress is lower,it can improve the sensitivity of the instrument,decrease the size and increase the force.

Thermal bimetal strip is by the different expansion coefficient of two or more than two layers of metal or metal solid combination, and along the entire interface varies with temperature and the thermal function of shape changes in composite materials.One of high expansion coefficient become active layer, low expansion coefficient becomes passive.When requirements with high resistivity, but heat sensitive resistance performance is essentially the same type of thermal bimetal series, can be added between the two layers of different thickness of middle layer as a shunt layer, is to achieve the purpose of control different resistivity.

The basic characteristic of the thermal bimetal is changing with temperature and temperature deformation, resulting in a certain moment.Many devices use this feature to convert heat energy into mechanical work to achieve automatic control.Thermal bimetal used for control system and temperature sensor in the measuring instrument.

Composition

Grade	108SP
High expansion layer	Mn75Ni15Cu10
Low expansion layer	Ni36

 
Chemical composition(%)
 

Grade	C	Si	Mn	P	S	Ni	Cr	Cu	Fe
Ni36	≤0.05	≤0.3	≤0.6	≤0.02	≤0.02	35~37	-	-	Bal.

 

Grade	C	Si	Mn	P	S	Ni	Cr	Cu	Fe
Mn75Ni15Cu10	≤0.05	≤0.5	Bal.	≤0.02	≤0.02	14~16	-	9~11	≤0.8

Typical Physical properties

Density (g/cm3)	7.7
Electrical resistivity at 20ºC(ohm mm^2/m)	1.13 ±5%
Thermal conductivity, λ/ W/(m*ºC)	6
Elastic Modulus,  E/ Gpa	113~142
Bending K / 10^-6 ºC^-1(20~135ºC)	20.8
Temperature bending rate  F/(20~130ºC)10^-6ºC^-1	39.0%±5%
Allowable temperature (ºC)	-70~ 200
Linear temperature (ºC)	-20~ 150

Application: The material is mainly used as Non magnetic non matching ceramic sealing material in Gyro and other electric vacuum devices