• Bright Kovar 4j29 Strip 0.4mm*200mm for Stamping IC Framework
  • Bright Kovar 4j29 Strip 0.4mm*200mm for Stamping IC Framework
  • Bright Kovar 4j29 Strip 0.4mm*200mm for Stamping IC Framework
  • Bright Kovar 4j29 Strip 0.4mm*200mm for Stamping IC Framework
  • Bright Kovar 4j29 Strip 0.4mm*200mm for Stamping IC Framework
  • Bright Kovar 4j29 Strip 0.4mm*200mm for Stamping IC Framework

Bright Kovar 4j29 Strip 0.4mm*200mm for Stamping IC Framework

Product Type: Strip
Material: Feni
Carbon Content: Low Carbon
Shape: Strip
Condition: Soft
Surface: Bright
Customization:

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Basic Info.

Model NO.
4J29
Thickness
0.1-2mm
Width
5-280mm
MOQ
30 Kgs
Transport Package
Coil, Waterproof Paper, Wooden Case
Trademark
TANKII-429
Origin
China
HS Code
722699900
Production Capacity
3000 Tons/Year

Product Description

Bright Kovar 4j29 Strip 0.4mm*200mm for Stamping IC Framework

Grade : Kovar nickel-cobalt ferrous alloy/ 29HK/ 4J29
 
Classification : the alloy of expansion characteristics

Application: Kovar (trademark of CRS Holdings, inc., Delaware[1]) is a nickel-cobalt ferrous alloy compositionally identical to Fernico 1, designed to be compatible with the thermal expansion characteristics of borosilicate glass (~5 × 10?6 /K between 30 and 200 °C, to ~10 × 10?6 /K at 800 °C) in order to allow direct mechanical connections over a range of temperatures. It finds application in electroplated conductors entering glass envelopes of electronic parts such as vacuum tubes (valves), X-ray and microwave tubes and some lightbulbs.
 
Chemical Composition in %  Kovar

 Ni
28,5-29,5%

Fe
51,14-54,5%

C
0.03%

Si
0.3%

Mn
0,4 %

S
o 0.015%

P
0.015%

o
17-18%

Ti
0.1%

Al
0.2%

Cu
0.2%

Cr
0,1 %
 
The thermal properties of alloy
 
Temperature coefficient of linear expansion αsr ? 10-6 K-1 in the temperature range, ° C inflection point temperature, ° C
No less
Heat treatment regime blanks and samples
20-80 20-100 20-300 20-400 20-450 20-500 20-800
- - 4,6-5,6 4,6-5,2 - 5,9-6,4 - 420 samples and blanks annealing in hydrogen, a vacuum or protective atmosphere at a temperature (960 ± 20) ° C, holding 1 hr., cooling with the furnace or container to 200 ° C at a rate not exceeding 10 ° C / min
 
Property sintered HIPed  
Density / g cm3 8.0 8.35  
Hardness / HV1 160 150  
Youngs Modulus / GPa 138 138  
reduction of area at fracture / % 30 30  
yield strength / MPa 270 270  
thermal conductivity / W/Km 17  
Curie Temperature / °C 435  
electrical resistivity Ω mm2 / m 0.49  
specific heat J/gK 0.46  
thermal expansion coefficient/10?6 K?1 (25 - 200 °C) 5.5  
(25-300 °C) 5.1  
(25-400 °C) 4.9  
(25-450 °C) 5.3  
(25-500 °C) 6.2  

Bright Kovar 4j29 Strip 0.4mm*200mm for Stamping IC Framework
Bright Kovar 4j29 Strip 0.4mm*200mm for Stamping IC Framework

 

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