Swg16-32 Stranded Copper Nickel Wire /ribbon CuNi23 for Thermal Overload Wire
Product Description
Material: CuNi1, CuNi2, CuNi6, CuNi8, cuni10, CuNi14, CuNi19, CuNi23, CuNi30, CuNi34, CuNi44. Manganin wire
Wire/Rod/Bar diameter: 0.02mm-30mm
Strip thickness: 0.1mm-5mm width: 5mm-200mm
Tankii Alloy, widely apply to chemical industry, metallurgy mechanism, glass industry, ceramic industry, home appliance area and so on, one of the best alloy producer in China. Fine wire, Tankii Produce.
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Fine Wire, Tankii Produce.
Characteristic |
Resistivity ( 200C μ Ω . m) |
Max. working Temperature ( 0C) |
Tensile Strength (Mpa) |
Melting point (0C) |
Density ( g/cm3) |
TCR x10-6/ 0C (20~600 0C) |
EMF vs Cu (μ V/ 0C) (0~100 0C) |
Alloy Nomenclature |
NC015(CuNi10) |
0.15± 10% |
250 |
≥ 290 |
1115 |
8.9 |
< 50 |
-25 |
Mechanical Properties |
Metric |
Comments |
Tensile Strength, Ultimate |
372 - 517 MPa |
|
Tensile Strength, Yield |
88.0 - 483 MPa |
Depending on temper |
Elongation at Break |
45.0 % |
in 381 mm. |
Modulus of Elasticity |
150 GPa |
|
Poissons Ratio |
0.320 |
Calculated |
Charpy Impact |
107 J |
|
Machinability |
20 % |
UNS C36000 (free-cutting brass) = 100% |
Shear Modulus |
57.0 GPa |
|
The most known, CuNi 10 presents the advantage of a very low temperature coefficient.
Their advantages are the following:
Very good resistance to corrosion
Very good malleability
Very good solderability
Chemical Composition and Main Property of Cu-Ni Low Resistance Alloy |
Properties\Grade |
CuNi1 |
CuNi2 |
CuNi6 |
CuNi8 |
CuMn3 |
CuNi10 |
Main Chemical Composition |
Ni |
1 |
2 |
6 |
8 |
_ |
10 |
Mn |
_ |
_ |
_ |
_ |
3 |
_ |
Cu |
Bal |
Bal |
Bal |
Bal |
Bal |
Bal |
Max Continuous Service Temperature(ºC) |
200 |
200 |
200 |
250 |
200 |
250 |
Resisivity at 20ºC (Ω*mm²/m) |
0.03 |
0.05 |
0.1 |
0.12 |
0.12 |
0.15 |
Density(g/cm³) |
8.9 |
8.9 |
8.9 |
8.9 |
8.8 |
8.9 |
Thermal Conductivity(α×10-6ºC) |
<100 |
<120 |
<60 |
<57 |
<38 |
<50 |
Tensile Strength(Mpa) |
≥210 |
≥220 |
≥250 |
≥270 |
≥290 |
≥290 |
EMF vs Cu(μVºC)(0~1000ºC) |
-8 |
-12 |
-12 |
-22 |
_ |
-25 |
Approximate Melting Point(ºC) |
1085 |
1090 |
1095 |
1097 |
1050 |
1100 |
Micrographic Structure |
austenite |
austenite |
austenite |
austenite |
austenite |
austenite |
Magnetic Property |
non |
non |
non |
non |
non |
non |
|
Properties\Grade |
CuNi14 |
CuNi19 |
CuNi23 |
CuNi30 |
CuNi34 |
CuNi44 |
Main Chemical Composition |
Ni |
14 |
19 |
23 |
30 |
34 |
44 |
Mn |
0.3 |
0.5 |
0.5 |
1 |
1 |
1 |
Cu |
Bal |
Bal |
Bal |
Bal |
Bal |
Bal |
Max Continuous Service TemperatureºC) |
300 |
300 |
300 |
350 |
350 |
400 |
Resisivity at 20ºC (Ω*mm²/m) |
0.2 |
0.25 |
0.3 |
0.35 |
0.4 |
0.49 |
Density(g/cm³) |
8.9 |
8.9 |
8.9 |
8.9 |
8.9 |
8.9 |
Thermal Conductivity(α×10-6ºC) |
<30 |
<25 |
<16 |
<10 |
<0 |
<-6 |
Tensile Strength(Mpa) |
≥310 |
≥340 |
≥350 |
≥400 |
≥400 |
≥420 |
EMF vs Cu(μVºC)(0~1000ºC) |
-28 |
-32 |
-34 |
-37 |
-39 |
-43 |
Approximate Melting Point(ºC) |
1115 |
1135 |
1150 |
1170 |
1180 |
1280 |
Micrographic Structure |
austenite |
austenite |
austenite |
austenite |
austenite |
austenite |
Magnetic Property |
non |
non |
non |
non |
non |
non |