Tankii Super Pure Copper Cu-ETP Foil

Product Details
Customization: Available
Sample: Small Order Accept
Size: 0.001-3mm*0.3-600mm
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Plant Area
>2000 square meters
Export Year
2008-08-20
  • Tankii Super Pure Copper Cu-ETP Foil
  • Tankii Super Pure Copper Cu-ETP Foil
  • Tankii Super Pure Copper Cu-ETP Foil
  • Tankii Super Pure Copper Cu-ETP Foil
  • Tankii Super Pure Copper Cu-ETP Foil
  • Tankii Super Pure Copper Cu-ETP Foil
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Basic Info.

Model NO.
Copper Strip
surface
bright
colour
RED
density
8.9g/cm3
purity
99.9 min
OEM
YES
State
Soft 1/4hard 1/2hard Hard T-hard
MOQ
20Kilograms
Poisonous
non-poisonous
Transport Package
in Roll, Wooden Case Outside
Specification
GB/T5231-2001
Trademark
TANKII
Origin
Shanghai China
HS Code
74101100
Production Capacity
2000 T/Year

Product Description

Super Pure Copper  Cu-ETP Foil - 0.01mm * 15mm

Cu%99.90 C11000 Cu ETP
Min thickness:0.001mm
little order can accept
Specification of red copper strip we supply:
Strip: thick:0.15-3.0mm width:610mm
Plate:thick:0.5-3mm width:610mm Length:2500mm

Chemical Content, %
Cu Bi Sb As Fe Ni Pb S Zn ROHS Directive
Cd Pb Hg Cr
99.90 0.001 0.002 0.002 0.005 - 0.005 0.005 - ND ND ND ND
 
Physical Properties
Melting Point - Liquidus 1083ºC
Melting Point - Solidus 1065ºC
Density 8.91 gm/cm3@ 20 ºC
Specific Gravity 8.91
Electrical Resistivity 1.71 microhm-cm @ 20 ºC
Electrical Conductivity** 0.591 MegaSiemens/cm @ 20 ºC
Thermal Conductivity 391.1 W/m ·oK at 20 C
Coefficient of Thermal Expansion 16.9 ·10-6perºC(20-100 ºC)
Coefficient of Thermal Expansion 17.3 ·10-6perºC(20-200 ºC)
Coefficient of Thermal Expansion 17.6·10-6perºC(20-300 ºC)
Specific Heat Capacity 393.5 J/kg ·oK at 293 K
Modulus of Elasticity in Tension 117000 Mpa
Modulus of Rigidity 44130 Mpa
 
With the assistance of our advanced technology, we offer quality range of Copper Strips and Plate. Manufactured using finest grade of raw material our array is widely used in numerous industries for excellent finish, corrosion resistance and durability. We even custom design these strips and flats as per client specific requirement.
Quality ltems General Technical Terms
1/3 OZ/ft 2 (12μ m) 1/2 OZ/ft 2 (18μ m) 3/4OZ/ft 2 25μ m 1 OZ/ft 2 35μ m 7/5 OZ/ft 2 (1.4μ m) 2 OZ/ft 2 (70μ m)
Area Weight(g/) 102-112 153 230 305 435 610
Tensile Strenght(kg/mm 2) STD-E ≥ 205 ≥ 205 ≥ 235 ≥ 275 ≥ 275 ≥ 275
HD-E ≥ 17 ≥ 103 ≥ 156 ≥ 205 ≥ 205 ≥ 205
Elongation(%) STD-E ≥ 2 ≥ 205 ≥ 3 ≥ 3 ≥ 3 ≥ 3
HD-E ≥ 2 ≥ 2.5 ≥ 3 ≥ 3 ≥ 5 ≥ 5
Surface Roughness(μ m) Shiny Surface Ra ≤ 0.43 ≤ 0.43 ≤ 0.43 ≤ 0.43 ≤ 0.43 ≤ 0.43
Matte Surface Rz 5 6 10 10 12 12
Peel Strength(Kg/cm) ≥ 1.1 ≥ 1.2 ≥ 1.8 ≥ 1.8 ≥ 2.1 ≥ 2.1
Leakage Poins(points/) ≤ 5   No
High Temperature Anti-Oxidization Performance Treat in the 200 constant temperature for 60 minutes, there is no oxidation stain

Application of Copper foil

1) Electric and electricsprings,switches
2) Lead frames
3) Connectors and oscillation reeds
3)PCB field
4) Communication cable, Cable armoring, Mobile phone mainboard
5) Ion battery production lamination with PI film
6) PCB collector(electrode backing) materials

Tankii Super Pure Copper Cu-ETP Foil

Tankii Super Pure Copper Cu-ETP Foil
Tankii Super Pure Copper Cu-ETP Foil
Tankii Super Pure Copper Cu-ETP Foil

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