Thermal bimetal strip ( RB-1 NIy)

• Customization: Available
• Product Type: Thermal bimetallic
• Material: Ni36 Mn72Ni10Cu18
• Model NO.: RB-1 NIy
• Carbon Content: Low Carbon
• Than bending: 20.8
• resistivity: 1.13
• density: 7.7g/cm³
• Allows the use of temperature: -70~200
• Modulus of elasticity: 113000
• use: Thermal protector
• Linear temperature: -20~150
• Temperature curvature: 39.0%±5%
• Transport Package: Wooden Case
• Specification: negotiable
• Trademark: tankii
• Origin: China
• HS Code: 7408229000
• Production Capacity: 30tons/Month

Product Description

Thermal bimetal strip ( RB-1 NIy)

A bimetallic strip is used to convert a temperature change into mechanical displacement. The strip consists of two strips of different metals which expand at different rates as they are heated, usually steel and copper, or in some cases steel and brass. The strips are joined together throughout thecir length by riveting, brazing or welding. The different expansions force the flat strip to bend one way if heated, and in the opposite direction if cooled below its initial temperature. The metal with the higher coefficient of thermal expansion is on the outer side of the curve when the strip is heated and on the inner side when cooled
The sideways displacement of the strip is much larger than the small lengthways expansion in either of the two metals. This effect is used in a range of mechanical and electrical devices. In some applications the bimetal strip is used in the flat form. In others, it is wrapped into a coil for compactness. The greater length of the coiled version gives improved sensitivity.
 

Grade	RB1
High expansion layer	Mn75Ni15Cu10
Low expansion layer	Ni36

 
 
Description:
Chemical composition(%)
 

Grade	C	Si	Mn	P	S	Ni	Cr	Cu	Fe
Ni36	≤0.05	≤0.3	≤0.6	≤0.02	≤0.02	35~37	-	-	Bal.

 

Grade	C	Si	Mn	P	S	Ni	Cr	Cu	Fe
Mn75Ni15Cu10	≤0.05	≤0.5	Bal.	≤0.02	≤0.02	14~16	-	9~11	≤0.8

Physical properties
>Density (g/cm3): 7.7
> Allowable temperature (ºC): -70~ 200
 Linear temperature (ºC): -20~ 150
>Electrical resistivity (μΩ*m): 1.13 ±5% (20ºC)
>Thermal conductivity ( W/m. ºC): 6
>Bending K / 10-6 ºC-1(20~135ºC): 20.8
> Elastic Modulus, E/GPa 113~142