Thermal bimetal alloy strip(Telcon 140)

Product Details
Customization: Available
Standard: JIS, GB
Certification: ISO
Manufacturer/Factory, Trading Company

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Plant Area
>2000 square meters
Export Year
2008-08-20
  • Thermal bimetal alloy strip(Telcon 140)
  • Thermal bimetal alloy strip(Telcon 140)
  • Thermal bimetal alloy strip(Telcon 140)
  • Thermal bimetal alloy strip(Telcon 140)
  • Thermal bimetal alloy strip(Telcon 140)
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Basic Info.

Model NO.
Telcon 140
Surface Treatment
light
Technique
Cold Rolled
Application
Flange Plate
Than bending
14.3
resistivity
0.8
density
8.2
Allows the use of temperature
-70~350
Linear temperature
-20~180
Temperature curvature
26.2%±5%
Modulus of elasticity
147000
use
Temperature measuring element
features
Medium than bending and resistivity
material
Ni22Cr3 Ni36
Transport Package
Wooden Case
Specification
negotiable
Trademark
tankii
Origin
China
HS Code
7408229000
Production Capacity
3000 Tons/Year

Product Description

Thermal bimetal alloy strip(Telcon 140)

The basic characteristic of the thermal bimetal is changing with temperature and temperature deformation, resulting in a certain moment.Many devices use this feature to convert heat energy into mechanical work to achieve automatic control.Thermal bimetal used for control system and temperature sensor in the measuring instrument.
 
shop sign Telcon 140
With brand  
Composite layer
alloybrand
High expansion layer Ni22Cr3
middle layer --------
Low expansion layer Ni36

Chemical composition
shop sign Ni Cr Fe Co Cu Zn Mn Si C S P
Ni36 35.0~37.0 - allowance - - - ≤0.6 ≤0.3 0.05 0.02 0.02
Ni22Cr3  21.0~23.0 2.0~4.0 allowance - - - 0.3~0.6 0.15~0.3 0.25~0.35 0.02 0.02

performance
Than bending K(20~135ºC) Temperature curvature
F/(greenhouse ~ 130 ºC)
 resistivity Linear temperature
/ ºC
Allows the use of temperature / ºC Density (g/cm after)
Nominal value Allowable deviation Standard values Allowable deviation
Level 1 Level  2
14.3 ±5% ±7% 26.2%±5% 0.8 ±5% -20~180 -70~350 8.2
 
Modulus of elasticity
E/GPa
Hardness (HV) Tensile strength
MPa
Allow stress MPa
High expansion layer Low expansion layer  minimum biggest
147~177 270~340 200~255 785~883 196 343
 
Thermal bimetal alloy strip(Telcon 140)

Thermal bimetal alloy strip(Telcon 140)
Thermal bimetal alloy strip(Telcon 140)
Thermal bimetal alloy strip(Telcon 140)
Thermal bimetal alloy strip(Telcon 140)
Thermal bimetal alloy strip(Telcon 140)

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