Bimetal Strip High ExpAN SIon Layer Mn75Ni15Cu10 Low expAN SIon layer Ni36
A bimetallic strip is used to convert a temperature change into mechanical displacement. The strip consists of two strips of different metals which expand at different rates as they are heated, usually steel and copper, or in some cases steel and brass. The strips are joined together throughout thecir length by riveting, brazing or welding. The different expAN SIons force the flat strip to bend one way if heated, and in the opposite direction if cooled below its initial temperature. The metal with the higher coefficient of thermal expAN SIon is on the outer side of the curve when the strip is heated and on the inner side when cooled
The sideways displacement of the strip is much larger than the small lengthways expAN SIon in either of the two metals. This effect is used in a range of mechanical and electrical devices. In some applications the bimetal strip is used in the flat form. In others, it is wrapped into a coil for compactness. The greater length of the coiled version gives improved sensitivity.
| Grade |
RB1 |
| High expAN SIon layer |
Mn75Ni15Cu10 |
| Low expAN SIon layer |
Ni36 |
Description:
Chemical composition(%)
| Grade |
C |
Si |
Mn |
P |
S |
Ni |
Cr |
Cu |
Fe |
| Ni36 |
≤0.05 |
≤0.3 |
≤0.6 |
≤0.02 |
≤0.02 |
35~37 |
- |
- |
Bal. |
| Grade |
C |
Si |
Mn |
P |
S |
Ni |
Cr |
Cu |
Fe |
| Mn75Ni15Cu10 |
≤0.05 |
≤0.5 |
Bal. |
≤0.02 |
≤0.02 |
14~16 |
- |
9~11 |
≤0.8 |
Physical properties
>Density (g/cm3): 7.7
> Allowable temperature (ºC): -70~ 200
Linear temperature (ºC): -20~ 150
>Electrical resistivity (μΩ*m): 1.13 ±5% (20ºC)
>Thermal conductivity ( W/m. ºC): 6
>Bending K / 10-6 ºC-1(20~135ºC): 20.8
> Elastic Modulus, E/GPa 113~142
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