Nickel Brass Copper Nickel Zinc Alloy Uns C77000 Plate /Sheet/strip

• Customization: Available
• Product Type: Strip
• Material: FeMn
• Model NO.: C77000
• Carbon Content: Low Carbon
• PCD: -
• ET: -
• Hole: -
• Size: T:0.01-5mm
• surface: bright
• standard: GB/ASTM/JIS/BIS/DIN
• Sample: Free
• Transport Package: 500m/Spool
• Specification: 0.01-3mm*0.3-600mm
• Trademark: TANKII
• Origin: Shanghai, China
• HS Code: 7409400000
• Production Capacity: 3000ton/Year

Product Description

Nickel Brass Copper Nickel Zinc Alloy Uns C77000 Plate /Sheet/strip

Cu-Ni-Zn alloy
Excellent corrosion resistance
good mechanical strength
Parameter for Nickel Silver Strips/Copper Nickel Zinc Strips:   
 

Alloy No.	Chemical Composition
	Cu	Mn	Ni	Zn
CuNi18Zn20	62.0-66	0-0.5	16.5-19.5	Remainder
CuNi15Zn20	60.0-64	0-0.5	12.5-15.5	Remainder
CuNi18Zn27	54.0-58	0-0.5	16.5-19.5	Remainder

 
 
CuNi18Zn20 Zinc Cupronickel Alloys
 
 UNS.C75200 Nickel Silver Alloys, also called Copper - Nickel - Zinc alloys, 65 - 18 - 18 respectively, 
which has good formability, good corrosion and tarnish - resistance performance, and this alloy has the pleasing 

Chemical composition

Articles				Chemical composition
GB	UNS	EN	JIS	Cu%	Ni%	Zn%
18-18	C75200	CuNi18Zn20	C7521	62-66	16.5-19.5	Rem

Physical Properties

Melting Point - Liquidus	1083ºC
Melting Point - Solidus	1065ºC
Density	8.91 gm/cm3@ 20 ºC
Specific Gravity	8.91
Electrical Resistivity	1.71 microhm-cm @ 20 ºC
Electrical Conductivity**	0.591 MegaSiemens/cm @ 20 ºC
Thermal Conductivity	391.1 W/m ·oK at 20 C
Coefficient of Thermal Expansion	16.9 ·10-6perºC(20-100 ºC)
Coefficient of Thermal Expansion	17.3 ·10-6perºC(20-200 ºC)
Coefficient of Thermal Expansion	17.6·10-6perºC(20-300 ºC)
Specific Heat Capacity	393.5 J/kg ·oK at 293 K
Modulus of Elasticity in Tension	117000 Mpa
Modulus of Rigidity	44130 Mpa

 

Application of Copper foil

1) Electric and electricsprings,switches
2) Lead frames
3) Connectors and oscillation reeds
3)PCB field
4) Communication cable, Cable armoring, Mobile phone mainboard
5) Ion battery production lamination with PI film
6) PCB collector(electrode backing) materials