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Swg16-32 Stranded Copper Nickel Wire /ribbon CuNi23 for Thermal Overload Wire
| Characteristic | Resistivity ( 200C μ Ω . m) | Max. working Temperature ( 0C) | Tensile Strength (Mpa) | Melting point (0C) | Density ( g/cm3) | TCR x10-6/ 0C (20~600 0C) | EMF vs Cu (μ V/ 0C) (0~100 0C) |
| Alloy Nomenclature | |||||||
| NC015(CuNi10) | 0.15± 10% | 250 | ≥ 290 | 1115 | 8.9 | < 50 | -25 |
| Mechanical Properties | Metric | Comments |
| Tensile Strength, Ultimate | 372 - 517 MPa | |
| Tensile Strength, Yield | 88.0 - 483 MPa | Depending on temper |
| Elongation at Break | 45.0 % | in 381 mm. |
| Modulus of Elasticity | 150 GPa | |
| Poissons Ratio | 0.320 | Calculated |
| Charpy Impact | 107 J | |
| Machinability | 20 % | UNS C36000 (free-cutting brass) = 100% |
| Shear Modulus | 57.0 GPa |
| Chemical Composition and Main Property of Cu-Ni Low Resistance Alloy | |||||||
| Properties\Grade | CuNi1 | CuNi2 | CuNi6 | CuNi8 | CuMn3 | CuNi10 | |
| Main Chemical Composition | Ni | 1 | 2 | 6 | 8 | _ | 10 |
| Mn | _ | _ | _ | _ | 3 | _ | |
| Cu | Bal | Bal | Bal | Bal | Bal | Bal | |
| Max Continuous Service Temperature(ºC) | 200 | 200 | 200 | 250 | 200 | 250 | |
| Resisivity at 20ºC (Ω*mm²/m) | 0.03 | 0.05 | 0.1 | 0.12 | 0.12 | 0.15 | |
| Density(g/cm³) | 8.9 | 8.9 | 8.9 | 8.9 | 8.8 | 8.9 | |
| Thermal Conductivity(α×10-6ºC) | <100 | <120 | <60 | <57 | <38 | <50 | |
| Tensile Strength(Mpa) | ≥210 | ≥220 | ≥250 | ≥270 | ≥290 | ≥290 | |
| EMF vs Cu(μVºC)(0~1000ºC) | -8 | -12 | -12 | -22 | _ | -25 | |
| Approximate Melting Point(ºC) | 1085 | 1090 | 1095 | 1097 | 1050 | 1100 | |
| Micrographic Structure | austenite | austenite | austenite | austenite | austenite | austenite | |
| Magnetic Property | non | non | non | non | non | non | |
| Properties\Grade | CuNi14 | CuNi19 | CuNi23 | CuNi30 | CuNi34 | CuNi44 | |
| Main Chemical Composition | Ni | 14 | 19 | 23 | 30 | 34 | 44 |
| Mn | 0.3 | 0.5 | 0.5 | 1 | 1 | 1 | |
| Cu | Bal | Bal | Bal | Bal | Bal | Bal | |
| Max Continuous Service TemperatureºC) | 300 | 300 | 300 | 350 | 350 | 400 | |
| Resisivity at 20ºC (Ω*mm²/m) | 0.2 | 0.25 | 0.3 | 0.35 | 0.4 | 0.49 | |
| Density(g/cm³) | 8.9 | 8.9 | 8.9 | 8.9 | 8.9 | 8.9 | |
| Thermal Conductivity(α×10-6ºC) | <30 | <25 | <16 | <10 | <0 | <-6 | |
| Tensile Strength(Mpa) | ≥310 | ≥340 | ≥350 | ≥400 | ≥400 | ≥420 | |
| EMF vs Cu(μVºC)(0~1000ºC) | -28 | -32 | -34 | -37 | -39 | -43 | |
| Approximate Melting Point(ºC) | 1115 | 1135 | 1150 | 1170 | 1180 | 1280 | |
| Micrographic Structure | austenite | austenite | austenite | austenite | austenite | austenite | |
| Magnetic Property | non | non | non | non | non | non | |








