Customization: | Available |
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Product Type: | Wire |
Material: | Cu/Ni |
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Characteristic | Resistivity ( 200C μΩ.m) | Max.working Temperature ( 0C) | Tensile Strength (Mpa) | Melting point (0C) | Density ( g/cm3) | TCR x10-6/ 0C (20~600 0C) | EMF vs Cu (μV/ 0C) (0~100 0C) |
Alloy Nomenclature | |||||||
NC020(CuNi14) | 0.2 | 300 | ≥310 | 1115 | 8.9 | <30 | -28 |
Ni | Mn | Fe | Si | Cu | Other | ROHS Directive | |||
Cd | Pb | Hg | Cr | ||||||
10 | 0.3 | - | - | Bal | - | ND | ND | ND | ND |
Max Continuous Service Temp | 250ºC |
Resisivity at 20ºC | 0.15±5%ohm mm2/m |
Density | 8.9 g/cm3 |
Thermal Conductivity | 50 (Max) |
Melting Point | 1100ºC |
Tensile Strength,N/mm2 Annealed,Soft | 210~370 Mpa |
Tensile Strength,N/mm2 Cold Rolled | 420~740 Mpa |
Elongation(anneal) | 25%(Min) |
Elongation(cold rolled) | 2% (Min) |
EMF vs Cu, μV/ºC (0~100ºC) | -25 |
Micrographic Structure | austenite |
Magnetic Property | Non |