| Product Type: | Wire |
|---|---|
| Material: | Cu/Ni |
| Carbon Content: | Low Carbon |
| PCD: | 420Min |
| ET: | 15mm |
| Hole: | 5 |
| Customization: |
|---|
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Audited Supplier | Characteristic | Resistivity ( 200C μΩ.m) | Max.working Temperature ( 0C) | Tensile Strength (Mpa) | Melting point (0C) | Density ( g/cm3) | TCR x10-6/ 0C (20~600 0C) | EMF vs Cu (μV/ 0C) (0~100 0C) |
| Alloy Nomenclature | |||||||
| NC020(CuNi14) | 0.2 | 300 | ≥310 | 1115 | 8.9 | <30 | -28 |
| Ni | Mn | Fe | Si | Cu | Other | ROHS Directive | |||
| Cd | Pb | Hg | Cr | ||||||
| 10 | 0.3 | - | - | Bal | - | ND | ND | ND | ND |
| Max Continuous Service Temp | 250ºC |
| Resisivity at 20ºC | 0.15±5%ohm mm2/m |
| Density | 8.9 g/cm3 |
| Thermal Conductivity | 50 (Max) |
| Melting Point | 1100ºC |
| Tensile Strength,N/mm2 Annealed,Soft | 210~370 Mpa |
| Tensile Strength,N/mm2 Cold Rolled | 420~740 Mpa |
| Elongation(anneal) | 25%(Min) |
| Elongation(cold rolled) | 2% (Min) |
| EMF vs Cu, μV/ºC (0~100ºC) | -25 |
| Micrographic Structure | austenite |
| Magnetic Property | Non |
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