| Customization: | Available |
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| Type: | copper alloy |
| Conductor Type: | Solid |
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| Characteristic | Resistivity ( 200C μ Ω . m) | Max. working Temperature ( 0C) | Tensile Strength (Mpa) | Melting point (0C) | Density ( g/cm3) | TCR x10-6/ 0C (20~600 0C) | EMF vs Cu (μ V/ 0C) (0~100 0C) |
| Alloy Nomenclature | |||||||
| NC003 (CuNi1) | 0.1 | 200 | ≥ 250 | 1095 | 8.9 | < 100 | -12 |
| Physical Properties | Metric | Comments |
| Density | 8.94 g/cc | |
| Mechanical Properties | Metric | Comments |
| Tensile Strength, Ultimate | 262 - 531 MPa | |
| Tensile Strength, Yield | 276 - 524 MPa | Depending on temper |
| Elongation at Break | 46.0 % | in 50.8 mm. |
| Modulus of Elasticity | 115 GPa | |
| Poissons Ratio | 0.310 | Calculated |
| Machinability | 20 % | UNS C36000 (free-cutting brass) = 100% |
| Shear Modulus | 44.0 GPa | |
| Electrical Properties | Metric | Comments |
| Electrical Resistivity | 0.0000120 ohm-cm @Temperature 20.0 ° C |
|
| Thermal Properties | Metric | Comments |
| CTE, linear | 17.5 µ m/m-° C @Temperature 20.0 - 300 ° C |
|
| Specific Heat Capacity | 0.380 J/g-° C | |
| Thermal Conductivity | 64.0 W/m-K @Temperature 20.0 ° C |
|
| Melting Point | < = 1125 ° C | Liquidus |
| Liquidus | 1125 ° C | |
| Processing Properties | Metric | Comments |
| Annealing Temperature | 565 - 815 ° C | |
| Hot-Working Temperature | 815 - 950 ° C | |
| Component Elements Properties | Metric | Comments |
| Copper, Cu | > = 91.2 % | |
| Iron, Fe | 1.30 - 1.70 % | |
| Lead, Pb | < = 0.050 % | |
| Manganese, Mn | 0.30 - 0.80 % | |
| Nickel, Ni | 4.80 - 6.20 % | |
| Zinc, Zn | < = 1.0 % |
CuNi44 Chemical Content, %
| Ni | Mn | Fe | Si | Cu | Other | ROHS Directive | |||
| Cd | Pb | Hg | Cr | ||||||
| 44 | 1% | 0.5 | - | Bal | - | ND | ND | ND | ND |
| Max Continuous Service Temp | 400ºC |
| Resisivity at 20ºC | 0.49±5%ohm mm2/m |
| Density | 8.9 g/cm3 |
| Thermal Conductivity | -6(Max) |
| Melting Point | 1280ºC |
| Tensile Strength,N/mm2 Annealed,Soft | 340~535 Mpa |
| Tensile Strength,N/mm3 Cold Rolled | 680~1070 Mpa |
| Elongation(anneal) | 25%(Min) |
| Elongation(cold rolled) | ≥Min)2%(Min) |
| EMF vs Cu, μV/ºC (0~100ºC) | -43 |
| Micrographic Structure | austenite |
| Magnetic Property | Non |
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